Triangular semiconductor die



FIG. 1 is a perspective view of a triangular semiconductor die showing our new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a side elevation view thereof;

FIG. 6 is another side elevation view thereof;

FIG. 7 is another side elevation view thereof; and,

FIG. 8 is another side elevation view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. 

CLAIM The ornamental design for triangular semiconductor die, as shown and described. 